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1 ? fn6887.1 ISL3178AE 15kv esd protected, 3. 3v, full fail-safe, low power, high speed or slew rate limited, rs-485/rs-422 transceivers the intersil ISL3178AE is 15kv iec61000 esd protected, 3.3v-powered, single transceivers that meet both the rs-485 and rs-422 standards for balanced communication. this device has very low bus currents (+125ma/-100ma), which presents a true ?1/8 unit load? to the rs-485 bus. this allows up to 256 transceivers on the network without violating the rs-485 specification?s 32 uni t load maximum, and without using repeaters. for example, in a remote utility meter reading system, individual meter readings are routed to a concentrator via an rs-485 network, so the high allowed node count minimizes the number of repeaters required. receiver (rx) inputs feature a ?full fail-safe? design, which ensures a logic high rx output if rx inputs are floating, shorted, or terminated but undriven. hot plug circuitry ensures that the tx and rx outputs remain in a high impedance state while the power supply stabilizes. the ISL3178AE is a half duplex version. it multiplexes the rx inputs and tx outputs to allow transceivers with output disable functions in an 8 ld package. pinout ISL3178AE (8 ld soic) top view features ? iec61000 esd protection on rs-485 i/o pins . . . . 15kv - class 3 esd level on all other pins . . . . . . >7kv hbm ? full fail-safe (open, short, terminated/floating) receivers ? hot plug - tx and rx outputs remain three-state during power-up (only versions with output enable pins) ? true 1/8 unit load allows up to 256 devices on the bus ? single 3.3v supply ? high data rates . . . . . . . . . . . . . . . . . . . . . . up to 10mbps ? low quiescent supply current . . . . . . . . . . .800a (max) - ultra low shutdown supply current . . . . . . . . . . .10na ? -7v to +12v common mode input/output voltage range ? half duplex pinouts ? three state rx and tx outputs available ? current limiting for driver overload protection ? pb-free (rohs compliant) applications ? automated utility meter reading systems ? high node count systems ? field bus networks ? security camera networks ? building environmental control/ lighting systems ? industrial/process control networks ro re de di 1 2 3 4 8 7 6 5 vcc b/z a/y gnd d r table 1. summary of features part number half/ful l duplex data rate (mbps) slew- rate limited? hot plug? # devices on bus rx/tx enable? quiescent i cc (a) low power shutdown? pin count ISL3178AEm half 10 no yes 256 yes 510 yes 8 ISL3178AEmw half 10 no yes 256 yes 510 yes n/a data sheet may 6, 2009 caution: these devices are sensitive to electrosta tic discharge; follow proper ic handling procedures. 1-888-intersil or 1-888-468-3774 | intersil (and design) is a registered trademark of intersil americas inc. copyright intersil americas inc. 2009. all rights reserved all other trademarks mentioned are the property of their respective owners.
2 fn6887.1 may 6, 2009 ordering information part number (note) part marking temp. range (c) package (pb-free) pkg. dwg. # ISL3178AEmbz* 3178a embz -55 to +125 8 ld soic m8.15 ISL3178AEmw -55 to +125 wafer *add ?-t? suffix for tape and reel. pl ease refer to tb347 for details on reel specifications. note: these intersil pb-free pl astic packaged products employ special pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is rohs compliant and compatible with both snpb and pb-free soldering operations). intersil pb-f ree products are msl classified at pb-free peak reflow temperatures that meet or exceed the pb-free requirements of ipc/jedec j std-020. truth tables transmitting inputs outputs re de di z y x1101 x1010 0 0 x high-z high-z 1 0 x high-z * high-z * note: *shutdown mode (see note 7) truth tables (continued) receiving inputs output re de half duplex de full duplex a-b ro 00 x -0.05v 1 00 x -0.2v 0 0 0 x inputs open/shorted 1 1 0 0 x high-z * 1 1 1 x high-z note: *shutdown mode (see note 7) pin descriptions pin function ro receiver output: if a-b -50mv, ro is high; if a-b -200mv, ro is low; ro = high if a a nd b are unconnected (floating) or shorted. re receiver output enable. ro is enabled when re is low; ro is high impedance when re is high. if the rx enable function isn?t required, connect re directly to gnd or through a 1k to 3k resistor to gnd. de driver output enable. the driver outputs, y and z, are enabled by bringing de high, and are high impedance when de is low. if the tx enable function isn?t requ ired, connect de to v cc through a 1k to 3k resistor. di driver input. a low on di forces output y low and output z hi gh. similarly, a high on di forces output y high and output z lo w. gnd ground connection. a/y 15kv iec61000 esd protected rs-485/422 leve l, noninverting receiver input and noninv erting driver output. pin is an input i f de = 0; pin is an output if de = 1. b/z 15kv iec61000 esd protected rs-485/422 level, inverting receiver input and inverting driver output. pin is an input if de = 0; pin is an output if de = 1. v cc system power supply input (3.0v to 3.6v). ISL3178AE
3 fn6887.1 may 6, 2009 typical application circuit 0.1f + d r 7 6 8 1 2 3 4 5 v cc gnd ro re de di a/y b/z +3.3v 0.1f + d r 6 7 8 1 2 3 4 5 v cc gnd ro re de di a/y b/z +3.3v r t r t ISL3178AE ISL3178AE
4 fn6887.1 may 6, 2009 absolute maximum rati ngs thermal information v cc to gnd. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7v input voltages di, de, re . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3v to 7v input/output voltages a/y, b/z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8v to +13v ro . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3v to (v cc +0.3v) short circuit duration y, z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . continuous esd rating . . . . . . . . . . . . . . . . . . . . . . . . . see specification table operating conditions temperature range . . . . . . . . . . . . . . . . . . . . . . . . .-55c to +125c thermal resistance (typical, note 1) ja (c/w) 8 ld soic package . . . . . . . . . . . . . . . . . . . . . . . . . 120 maximum junction temperature (plastic package) . . . . . . +150c maximum storage temperature range . . . . . . . . . .-65c to +150c pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/pb-freereflow.asp caution: do not operate at or near the maximum ratings listed fo r extended periods of time. exposure to such conditions may adv ersely impact product reliability and result in failures not covered by warranty. note: 1. ja is measured with the component mounted on a high effective therma l conductivity test board in free air. see tech brief tb379 f or details. electrical specifications test conditions: v cc = 3.0v to 3.6v; unless otherwise specified. typicals are at v cc = 3.3v, t a = +25c, (note 2). parameters with min and/or max limits are 100% tested at +25c, unless otherwise specified. temperature limits established by charac terization and are not production tested. parameter symbol test conditions temp (c) min typ max units dc characteristics driver differential v out v od r l = 100 (rs-422) (figure 1a, note 11) full 2 2.3 - v r l = 54 (rs-485) (figure 1a) full 1.5 2 v cc v no load - - v cc r l = 60 , -7v v cm 12v (figure 1b) full 1.5 2.2 - v change in magnitude of driver differential v out for complementary output states v od r l = 54 or 100 (figure 1a) full - 0.01 0.2 v driver common-mode v out v oc r l = 54 or 100 (figure 1a) full - 2 3 v change in magnitude of driver common-mode v out for complementary output states v oc r l = 54 or 100 (figure 1a) full - 0.01 0.2 v logic input high voltage v ih di, de, re full 2 - - v logic input low voltage v il di, de, re full - - 0.8 v logic input hysteresis v hys de, re (note 12) 25 - 100 - mv logic input current i in1 di = de = re = 0v or v cc (note 13) full -2 - 2 a input current (a/y, b/z) i in2 de = 0v, v cc = 0v or 3.6v v in = 12v full - 80 125 a v in = -7v full -100 -50 - a driver short-circuit current, v o = high or low i osd1 de = v cc , -7v v y or v z 12v (note 4) full - - 250 ma receiver differential threshold voltage v th -7v v cm 12v (note 12) full -200 -125 -50 mv receiver input hysteresis v th v cm = 0v 25 - 15 - mv receiver output high voltage v oh i o = -4ma, v id = -50mv full v cc - 0.6 - - v receiver output low voltage v ol i o = -4ma, v id = -200mv full - 0.17 0.4 v three-state (high impedance) receiver output current i ozr 0.4v v o 2.4v full -1 0.015 1 a receiver input resistance r in -7v v cm 12v full 96 150 - k receiver short-circuit current i osr 0v v o v cc full 7 30 60 ma ISL3178AE
5 fn6887.1 may 6, 2009 supply current no-load supply current (note 3) i cc di = 0v or v cc de = v cc , re = 0v or v cc full - 510 800 a de = 0v, re = 0v full - 480 700 a shutdown supply current i shdn de = 0v, re = v cc , di = 0v or v cc full - 0.01 12 a esd performance rs-485 pins (a/y, b/z) iec61000-4-2, air-gap discharge method 25 - 15 - kv iec61000-4-2, contact discharge method 25 - 8 - kv human body model, from bus pins to gnd 25 - 15 - kv all pins hbm, per mil-std-883 method 3015 25 - 7 - kv machine model 25 - 200 - v driver switching characteristics (ISL3178AE) maximum data rate f max v od = 1.5v, c d = 350pf (figure 4, note 12) full - 10 - mbps driver differential output delay t dd r diff = 54 , c d = 50pf (figure 2) full - 27 40 ns driver differential output skew t skew r diff = 54 , c d = 50pf (figure 2) full - 1 3 ns driver output skew, part-to-part t dskew r diff = 54 , c d = 50pf (figure 2, notes 10, 12) full - - 11 ns driver differential rise or fall time t r , t f r diff = 54 , c d = 50pf (figure 2) full - 9 15 ns driver enable to output high t zh r l = 500 , c l = 50pf, sw = gnd (figure 3), (note 5) full - 17 50 ns driver enable to output low t zl r l = 500 , c l = 50pf, sw = v cc (figure 3), (note 5) full - 16 40 ns driver disable from output high t hz r l = 500 , c l = 50pf, sw = gnd (figure 3) full - 25 40 ns driver disable from output low t lz r l = 500 , c l = 50pf, sw = v cc (figure 3), full - 28 50 ns time to shutdown t shdn (notes 7, 12) full 50 200 600 ns driver enable from shutdown to output high t zh(shdn) r l = 500 , c l = 50pf, sw = gnd (figure 3), (notes 7, 8) full - 180 700 ns driver enable from shutdown to output low t zl(shdn) r l = 500 , c l = 50pf, sw = v cc (figure 3), (notes 7, 8) full - 90 700 ns receiver switching characteristics (ISL3178AE) maximum data rate f max v id = 1.5v (note 12) full - 10 - mbps receiver input to output delay t plh , t phl (figure 5) full 25 33 65 ns receiver skew | t plh - t phl |t skd (figure 5) full - 1.5 10 ns receiver skew, part-to-part t rskew (figure 5, notes 10, 12) full - - 15 ns receiver enable to output high t zh r l = 1k , c l = 15pf, sw = gnd (figure 6), (notes 6) full 5 11 17 ns receiver enable to output low t zl r l = 1k , c l = 15pf, sw = v cc (figure 6), (notes 6,) full 5 11 17 ns receiver disable from output high t hz r l = 1k , c l = 15pf, sw = gnd (figure 6), full 4 7 15 ns receiver disable from output low t lz r l = 1k , c l = 15pf, sw = v cc (figure 6), full 4 7 15 ns time to shutdown t shdn (notes 7, 12) full 50 180 600 ns electrical specifications test conditions: v cc = 3.0v to 3.6v; unless otherwise specified. typicals are at v cc = 3.3v, t a = +25c, (note 2). parameters with min and/or max limits are 100% tested at +25c, unless otherwise specified. temperature limits established by charac terization and are not production tested. parameter symbol test conditions temp (c) min typ max units ISL3178AE
6 fn6887.1 may 6, 2009 receiver enable from shutdown to output high t zh(shdn) r l = 1k , c l = 15pf, sw = gnd (figure 6), (notes 7, 9) full - 240 500 ns receiver enable from shutdown to output low t zl(shdn) r l = 1k , c l = 15pf, sw = v cc (figure 6), (notes 7, 9) full - 240 500 ns notes: 2. all currents into device pins are positive; all currents out of device pins are negative. all voltages are referenced to devi ce ground unless otherwise specified. 3. supply current specification is va lid for loaded drivers when de = 0v. 4. applies to peak current. see ?typical performance curves? starting on page 10 for more information. 5. when testing devices with the shutdown feature, keep re = 0 to prevent the device from entering shdn. 6. when testing devices with the shutdown feature, the re signal high time must be short enough (typ ically <100ns) to prevent the device from entering shdn. 7. versions with a shutdown feature are put into shutdown by bringing re high and de low. if the inputs are in this state for less than 50ns, the parts are guaranteed not to enter shutdown. if the inputs are in this state for at least 600ns, the parts are guaranteed to have ente red shutdown. see ?low power shutdown mode? on page 10. 8. keep re = vcc, and set the de signal low time > 600ns to ensure that the device enters shdn. 9. set the re signal high time >600ns to ensure that the device enters shdn. 10. t skew is the magnitude of the difference in propagation delays of the specified terminals of two units tested with identical test co nditions (v cc , temperature, etc.). 11. v cc 3.15v 12. limits established by characterization and are not production tested. 13. if the tx or rx enable function isn?t needed, connect the enable pin to the appropriate supply (see ?pin descriptions? on pa ge 2) through a 1k to 3k resistor. 14. for wafer sale the switching test lim its are established by characterization. test circuits and waveforms figure 1a. v od and v oc figure 1b. v od with common mode load figure 1. dc driver test circuits electrical specifications test conditions: v cc = 3.0v to 3.6v; unless otherwise specified. typicals are at v cc = 3.3v, t a = +25c, (note 2). parameters with min and/or max limits are 100% tested at +25c, unless otherwise specified. temperature limits established by charac terization and are not production tested. parameter symbol test conditions temp (c) min typ max units d de di v cc v od v oc r l /2 r l /2 z y d de di v cc v od 375 375 z y r l = 60 v cm -7v to +12v ISL3178AE
7 fn6887.1 may 6, 2009 figure 2a. test circuit figure 2b. measurement points figure 2. driver propagation delay and differential transition times figure 3a. test circuit figure 3b. measurement points figure 3. driver enable and disable times figure 4a. test circuit figure 4b. measurement points figure 4. driver data rate test circuits and waveforms (continued) d de di v cc signal generator c d r diff z y out (z) 3v 0v 1.5v 1.5v v oh v ol out (y) t plh t phl diff out (y to z) t r +v od -v od 90% 90% t f 10% 10% di skew = |t plh - t phl | d de di z y v cc gnd sw parameter output re di sw t hz y/z x 1/0 gnd t lz y/z x 0/1 v cc t zh y/z 0 (note 5) 1/0 gnd t zl y/z 0 (note 5) 0/1 v cc t zh(shdn) y/z 1 (note 8) 1/0 gnd t zl(shdn) y/z 1 (note 8) 0/1 v cc signal generator 500 50pf out (y, z) 3v 0v 1.5v 1.5v v oh 0v v oh - 0.25v t hz out (y, z) v cc v ol v ol + 0.25v t lz de output high output low t zl , t zl(shdn) t zh , t zh(shdn) note 9 50% 50% note 9 note 9 d de di v cc signal generator z y c d v od + - 54 3v 0v diff out (y to z) +v od -v od di 0v ISL3178AE
8 fn6887.1 may 6, 2009 application information rs-485 and rs-422 are differential (balanced) data transmission standards for use in long haul or noisy environments. rs-422 is a subset of rs-485, so rs-485 transceivers are also rs-422 compliant. rs-422 is a point-to-multipoint (multidrop) standard, which allows only one driver and up to 10 (assuming one unit load devices) receivers on each bus. rs-485 is a true multipoint standard, which allows up to 32 one-unit load devices (any combination of drivers and receivers) on each bus. to allow for multipoint operation, the rs-485 spec requires that drivers must handle bus contention without sustaining any damage. another important advantage of rs-485 is the extended common mode range (cmr), which specifies that the driver outputs and receiver inputs withstand signals that range from +12v to -7v. rs-422 and rs-485 are intended for long runs, thus the wide cmr is necessary to handle ground potential differences, as well as voltages induced in the cable by external fields. receiver features this device utilizes a differential input receiver for maximum noise immunity and common mode rejection. input sensitivity is better than 200mv, as r equired by the rs-422 and rs-485 specifications. receiver input resistance of 96k surpasses the rs-422 spec of 4k and is eight times the rs-485 ?unit load (ul)? requirement of 12k minimum. thus, these products are known as ?one-eighth ul? tran sceivers and there can be up to 256 of these devices on a network while still complying with the rs-485 l oading specification. receiver inputs function with common mode voltages as great as +9v/-7v outside the power supplies (i.e., +12v and -7v), making them ideal for long networks where induced voltages and ground potential differenc es are realistic concerns. all the receivers include a ?full fail-safe? function that guarantees a high level receiver output if the receiver inputs are unconnected (floating) or sh orted. fail-safe with shorted inputs is achieved by setting the rx upper switching point to -50mv, thereby ensuring that the rx sees 0v differential as a high input level. figure 5a. test circuit figure 5b. measurement points figure 5. receiver propagation delay figure 6a. test circuit figure 6b. measurement points figure 6. receiver enable and disable times test circuits and waveforms (continued) signal generator r ro re a b gnd 15pf ro +1.5v -1.5v t plh 0v 0v v cc 0v 1.5v 1.5v t phl a 1k v cc gnd sw parameter de a sw t hz x +1.5v gnd t lz x -1.5v v cc t zh (note 6) 0 +1.5v gnd t zl (note 6) 0 -1.5v v cc t zh(shdn) (note 9) 0 +1.5v gnd t zl(shdn) (note 11) 0 -1.5v v cc signal generator r ro re a b gnd 15pf ro 3v 0v 1.5v 1.5v v oh 0v 1.5v v oh - 0.25v t hz ro v cc v ol 1.5v v ol + 0.25v t lz re output high output low t zl , t zl(shdn) t zh , t zh(shdn) note 9 note 9 note 9 ISL3178AE
9 fn6887.1 may 6, 2009 receivers easily meet the data rates supported by the corresponding driver, and all receiver outputs are tri-statable via the active low re input. driver features the rs-485/422 driver is a diff erential output device that delivers at least 1.5v across a 54 load (rs-485) and at least 2v across a 100 load (rs-422). the drivers feature low propagation delay skew to maximize bit width and to minimize emi. the drivers is tri-statable via the active high de input. outputs of the ISL3178AE driver s are not limited, so faster output transition times allow data rates of at least 10mbps. hot plug function when a piece of equipment powers up, there is a period of time where the processor or as ic driving the rs-485 control lines (de, re ) is unable to ensure that the rs-485 tx and rx outputs are kept disabled. if the equipment is connected to the bus, a driver activating prematurely during power up may crash the bus. to avoid this scenario, the ISL3178AE versions with output enable pins incorporate a ?hot plug? function. during power-up, circuitry monitoring v cc ensures that the tx and rx outputs remain disabled for a period of time, regardless of the state of de and re . this gives the processor/asic a chance to st abilize and drive the rs-485 control lines to the proper states. esd protection all pins on this device includes class 3 (>7kv) human body model (hbm) esd protection structures, but the rs-485 pins (driver outputs and receiver inputs) incorporate advanced structures allowing them to survive esd events in excess of 15kv hbm and 15kv iec61000. the rs-485 pins are particularly vulnerable to esd damage because they typically connec t to an exposed port on the exterior of the finished product. simply touching the port pins, or connecting a cable, ca n cause an esd event that might destroy unprotected ics. these new esd structures protect the device whether or not it is powered up, and without degrading the rs-485 common mode range of -7v to +12v. this built-in esd protection eliminates the need for board level protection structures (e.g., transient suppression diodes), and th e associated, undesirable capacitive load they present. iec61000-4-2 testing the iec61000 test method applies to finished equipment, rather than to an individual ic. therefore, the pins most likely to suffer an esd event are t hose that are exposed to the outside world (the rs-485 pins in this case), and the ic is tested in its typical application configuration (power applied) rather than testing each pin-to-pin combination. the lower current limiting resistor coup led with the larger charge storage capacitor yields a test that is much more severe than the hbm test. the extra esd pr otection built into this device?s rs-485 pins allows the design of equipment meeting level 4 criteria with out the need for additional board level protection on the rs-485 port. air-gap discharge test method for this test method, a charged probe tip moves toward the ic pin until the voltage arcs to it. the current waveform delivered to the ic pin depends on approach speed, humidity, temperature, etc. so it is difficult to obtain repeatable results. the ISL3178AE rs-485 pins withstand 15kv air-gap discharges. contact discharge test method during the contact discharge test, the probe contacts the tested pin before the probe tip is energized, thereby eliminating the variables associated with the air-gap discharge. the result is a more repeatable and predictable test, but equipment limits prevent testing devices at voltages higher than 8kv. the ISL3178AE survives 8kv contact discharges on the rs-485 pins. data rate, cables, and terminations rs-485/422 are intended for network lengths up to 4000?, but the maximum system data rate decreases as the transmission length increase s. the device operates at 10mbps are limited to lengths less than 100?. twisted pair is the cable of choice for rs-485/422 networks. twisted pair cables tend to pick up noise and other electromagnetically induced voltages as common mode signals, which are effectively rejected by the differential receivers in these ics. proper termination is imperative to minimize reflections. short networks using the 250kbps versions need not be terminated, but, terminations are recommended unless power dissipation is an overriding concern. in point-to-point, or point-to-mu ltipoint (single driver on bus) networks, the main cable should be terminated in its characteristic impedance (typically 120 ) at the end farthest from the driver. in multi-receiver applications, stubs connecting receiver to the main cable should be kept as short as possible. multipoint (multi-driver) systems require that the main cable be terminated in its characteristic impedance at both ends. stubs connecting a transceiver to the main cable should be kept as short as possible. built-in driver overload protection as stated previously, the rs-485 spec requires that drivers survive worst case bus c ontentions undamaged. these devices meet this requirement via driver output short circuit current limit circuitry. the driver output stages incorporate short circuit current limiting circuitry which ensures that the output current never exceeds the rs-485 spec, even at the common mode voltage range extremes. additionally, these devices utilize a foldback circuit which reduces the short circuit current, and ISL3178AE
10 fn6887.1 may 6, 2009 thus the power dissipation, whenever the contending voltage exceeds either supply. low power shutdown mode this cmos transceiver all uses a fraction of the power required by its bipolar counterparts, but it also includes a shutdown feature that reduces the already low quiescent i cc to a 10na trickle. this device enters shutdown whenever the receiver and driver are simultaneously disabled (re =v cc and de = gnd) for a period of at least 600ns. disabling both the driver and the receiver fo r less than 50ns guarantees that the transceiver will not enter shutdown. note that receiver and driver enable times increase when the transceiver enables from shutdown. refer to notes 5 through 9, at the end of the ?electrical specification table? on page 6, for more information. typical performance curves v cc = 3.3v, t a = +25c; unless otherwise specified figure 7. driver output current vs differential output voltage figure 8. driver differential output voltage vs temperature figure 9. driver output current vs short circuit voltage figure 10. supply current vs temperature differential output voltage (v) driver output current (ma) 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 20 40 60 80 100 120 1.5 1.7 1.9 2.1 2.3 2.5 2.7 2.9 -60 -40 -20 0 20 40 60 80 100 120 temperature (c) differential output voltage (v) rdiff = 120 rdiff = 54 output voltage (v) -7 -6 -4 -2 0 2 4 6 8 10 12 output current (ma) -50 0 50 100 150 200 -100 -150 y or z = high y or z = low 350 400 450 500 550 600 -60 -40 -20 0 20 40 60 80 100 120 temperature (c) icc (a) icc de-vcc icc de-gnd ISL3178AE
11 fn6887.1 may 6, 2009 figure 11. driver differential propagation delay vs temperature) figure 12. driver differential skew vs temperature figure 13. driver and receiver waveforms, low to high figure 14. driver and receiver waveforms, high to low figure 15. receiver output curre nt vs receiver output voltage typical performance curves v cc = 3.3v, t a = +25c; unless otherwise specified (continued) 0 5 10 15 20 25 30 35 40 -60 -45 -30 -15 0 15 30 45 60 75 90 105 120 temperature (c) propagation delay (ns) tphl tplh 1 1.1 1.2 1.3 1.4 1.5 1.6 -60 -45 -30 -15 0 15 30 45 60 75 90 105 120 temperature (c) skew (ns) time (10ns/div) receiver output (v) r diff = 54 , c d = 50pf 0 5 driver output (v) 0 5 driver input (v) di ro 0 0.5 1.0 1.5 2.0 2.5 3.0 b/z a/y time (10ns/div) receiver output (v) r diff = 54 , c d = 50pf 0 5 driver output (v) 0 5 driver input (v) di ro 0 0.5 1.0 1.5 2.0 2.5 3.0 b/z a/y receiver output voltage (v) receiver output current (ma) 01.02.03.03.5 1.5 2.5 0.5 0 5 10 15 20 25 30 35 v oh , +25c v oh , +85c v ol , +25c v ol , +85c ISL3178AE
12 fn6887.1 may 6, 2009 die characteristics die dimensions thickness: 19 mils 1295m x 1350m interface materials glassivation sandwich teos & nitride top metallization: type: al with 0.5% cu thickness: 28ka substrate n/a backside finish silicon/polysilicon/oxide assembly related information substrate potential gnd (powered up) additional information worst case current density n/a process si gatebicmos transistor count 535 pad opening size 90m x 90m wafer size 200mm (~8 inch) transistor count 535 table 2. bond pad function and coordinates pad # function x (m) y (m) 1 ro 54.5 1086.2 2re 54.5 800.2 3 de 54.5 476.8 4 di 53.0 318.35 5 gnd2 398.55 59.7 6 gnd1 508.55 59.7 7 y 931.70 70.5 8 a (half duplex) 916.25 382.45 9 z 921.2 694.4 10 b 892.1 830.35 11 a (full duplex) 887.2 1075.2 12 v cc 517.55 1163.55 ISL3178AE
13 fn6887.1 may 6, 2009 ISL3178AE metallization mask layout ISL3178AE ro re de d1 g2 g1 y a z b a vcc
14 all intersil u.s. products are manufactured, asse mbled and tested utilizing iso9000 quality systems. intersil corporation?s quality certifications ca n be viewed at www.intersil.com/design/quality intersil products are sold by description only. intersil corpor ation reserves the right to make changes in circuit design, soft ware and/or specifications at any time without notice. accordingly, the reader is cautioned to verify that data sheets are current before placing orders. information furnishe d by intersil is believed to be accurate and reliable. however, no responsibility is assumed by intersil or its subsidiaries for its use; nor for any infringements of paten ts or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of intersil or its subsidiari es. for information regarding intersil corporation and its products, see www.intersil.com fn6887.1 may 6, 2009 ISL3178AE small outline plast ic packages (soic) index area e d n 123 -b- 0.25(0.010) c a m bs e -a- l b m -c- a1 a seating plane 0.10(0.004) h x 45 c h 0.25(0.010) b m m notes: 1. symbols are defined in the ?mo series symbol list? in section 2.2 of publication number 95. 2. dimensioning and tolerancing per ansi y14.5m - 1982. 3. dimension ?d? does not include mold flash, protrusions or gate burrs. mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. dimension ?e? does not include in terlead flash or protrusions. inter- lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. the chamfer on the body is optional. if it is not present, a visual index feature must be located within the crosshatched area. 6. ?l? is the length of terminal for soldering to a substrate. 7. ?n? is the number of terminal positions. 8. terminal numbers are shown for reference only. 9. the lead width ?b?, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. controlling dimension: millimete r. converted inch dimensions are not necessarily exact. m8.15 (jedec ms-012-aa issue c) 8 lead narrow body small outline plastic package symbol inches millimeters notes min max min max a 0.0532 0.0688 1.35 1.75 - a1 0.0040 0.0098 0.10 0.25 - b 0.013 0.020 0.33 0.51 9 c 0.0075 0.0098 0.19 0.25 - d 0.1890 0.1968 4.80 5.00 3 e 0.1497 0.1574 3.80 4.00 4 e 0.050 bsc 1.27 bsc - h 0.2284 0.2440 5.80 6.20 - h 0.0099 0.0196 0.25 0.50 5 l 0.016 0.050 0.40 1.27 6 n8 87 0 8 0 8 - rev. 1 6/05

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